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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3593 Surface mounting technology>CSN EN 62137-3 - Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
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CSN EN 62137-3 - Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

CSN EN 62137-3

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

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English Hardcopy
In stock
93.34 USD
Category:359391
Released:2012
Number of Standard:CSN EN 62137-3
DESCRIPTION

EN 62137-3


EN 62137-3 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints - IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following: - no technical changes; - some editorial changes and corrections; - for the sake of convenience some constitutive changes.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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