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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61188-6-1 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Released: 01.10.2021
CSN EN IEC 61188-6-1 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

CSN EN IEC 61188-6-1

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

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Number of Standard:CSN EN IEC 61188-6-1
Category:359038
Pages:40
Released:01.10.2021
Catalog number:512756
DESCRIPTION

CSN EN IEC 61188-6-1

CSN EN IEC 61188-6-1 This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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