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>CSN Standards>35 ELECTRICAL ENGINEERING>3590 Printed wiring>CSN EN IEC 61189-3-302 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Released: 01.05.2026
CSN EN IEC 61189-3-302 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

CSN EN IEC 61189-3-302

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

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Number of Standard:CSN EN IEC 61189-3-302
Category:359039
Pages:28
Released:01.05.2026
Catalog number:523336
DESCRIPTION

CSN EN IEC 61189-3-302

CSN EN IEC 61189-3-302 This part of IEC 61189 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holes.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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