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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3593 Surface mounting technology>CSN EN IEC 62878-1 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Released: 01.04.2020
CSN EN IEC 62878-1 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

CSN EN IEC 62878-1

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

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Number of Standard:CSN EN IEC 62878-1
Category:359378
Pages:28
Released:01.04.2020
Catalog number:509546
DESCRIPTION

CSN EN IEC 62878-1

CSN EN IEC 62878-1 This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.