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3590 Printed wiring

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CSN EN 61249-4-18
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2013

English Hardcopy

In stock

64.71 USD

CSN EN 61249-4-19
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Released: 2013

English Hardcopy

In stock

64.71 USD

CSN EN 61249-4-2
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

Released: 2005

English Hardcopy

In stock

64.71 USD

CSN EN 61249-4-5
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Released: 2005

English Hardcopy

In stock

64.71 USD

CSN EN 62326-20
Printed boards - Part 20: Printed circuit boards for high- brightness LEDs

Released: 2016

English Hardcopy

In stock

98.83 USD

CSN EN 62326-4-1
Printed boards. Part 4: Rigid multilayer printed boards with interlayer connections. Sectional specification. Section 1: Capability Detail Specification. Performance levels A, B and C

Released: 1997

English Hardcopy

In stock

138.83 USD

CSN EN IEC 61188-6-1
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

English Hardcopy

In stock

90.59 USD

CSN EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

English Hardcopy

In stock

74.12 USD

CSN EN IEC 61188-6-4
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

English Hardcopy

In stock

98.83 USD

CSN EN IEC 61189-2-630
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning

English Hardcopy

In stock

54.12 USD

CSN EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

English Hardcopy

In stock

54.12 USD

CSN EN IEC 61189-5-301
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

English Hardcopy

In stock

90.59 USD

67 results

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