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immediate downloadReleased: 2010-01-07
IEC 60191-6-18:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)
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English/French - Bilingual PDF
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| Standard number: | IEC 60191-6-18:2010 |
| Released: | 2010-01-07 |
| Edition: | 1 |
| ICS: | 31.080.01 |
| Pages (English/French - Bilingual): | 40 |
| ISBN (English/French - Bilingual): | 9782889100651 |
DESCRIPTION
IEC 60191-6-18:2010
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger. This standard cancels and replaces IEC/PAS 60191-6-18 published in 2008. This first edition constitutes a technical revision. The contents of the corrigenda of May 2010 and July 2010 have been included in this copy.