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Homepage>IEC Standards>IEC 60317-23:2013+AMD1:2019 CSV - Specifications for particular types of winding wires - Part 23: Solderable polyesterimide enamelled round copper wire, class 180
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download between 0-24 hoursReleased: 2019-06-12
IEC 60317-23:2013+AMD1:2019 CSV - Specifications for particular types of winding wires - Part 23: Solderable polyesterimide enamelled round copper wire, class 180

IEC 60317-23:2013+AMD1:2019 CSV

Specifications for particular types of winding wires - Part 23: Solderable polyesterimide enamelled round copper wire, class 180

Spécifications pour types particuliers de fils de bobinage - Partie 23: Fil brasable de section circulaire en cuivre émaillé avec polyestérimide, classe 180

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English/French - Bilingual
Standard number:IEC 60317-23:2013+AMD1:2019 CSV
Released:2019-06-12
Language:English/French - Bilingual
DESCRIPTION

IEC 60317-23:2013+AMD1:2019 CSV

IEC 60317-23:2013+A1:2019 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a sole coating based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: - Grade 1: 0,020 mm up to and including 1,600 mm; - Grade 2: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This third edition cancels and replaces the second edition published in 1990, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - new 3.2.2 containing general notes on winding wire, formerly a part of the scope; - revision to references to IEC 60317-0-1:2013 to clarify that their application is normative; - consolidation of 17.1 and 17.2 of the solderability requirements; - modification to Clause 19, Dielectric dissipation factor; - new Clause 23, Pin hole test. This consolidated version consists of the third edition (2013) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication. Keywords: requirements of solderable enamelled round copper winding wire, class 180, sole coating based on polyesterimide resin