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immediate downloadReleased: 2010-07-28
IEC 60749-19:2003/AMD1:2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Amendement 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19: Résistance de la pastille au cisaillement
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English/French - Bilingual PDF
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10.80 EUR
English/French - Bilingual Hardcopy
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| Standard number: | IEC 60749-19:2003/AMD1:2010 |
| Released: | 2010-07-28 |
| Edition: | 1 |
| ICS: | 31.080.01 |
| Pages (English/French - Bilingual): | 4 |
| ISBN (English/French - Bilingual): | 9782889120727 |
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