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Main page>IEC Standards>IEC 60749-19:2003/AMD1:2010 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
immediate downloadReleased: 2010-07-28
IEC 60749-19:2003/AMD1:2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Amendement 1 - Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19: Résistance de la pastille au cisaillement
