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Main page>IEC Standards>IEC 60749-32:2002+AMD1:2010 CSV - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
immediate downloadReleased: 2010-11-29
IEC 60749-32:2002+AMD1:2010 CSV - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

IEC 60749-32:2002+AMD1:2010 CSV

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 32: Inflammabilité des dispositifs à encapsulation plastique (cas d'une cause extérieure d'inflammation)

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Standard number:IEC 60749-32:2002+AMD1:2010 CSV
Released:2010-11-29
Edition:1.1
ICS:31.080.01
Pages (English/French - Bilingual):9
ISBN (English/French - Bilingual):9782889122349
DESCRIPTION

IEC 60749-32:2002+AMD1:2010 CSV

IEC 60749-32:2002+A1:2010 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. This consolidated version consists of the first edition (2002) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.

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