PRICES include / exclude VAT
Homepage>IEC Standards>IEC 61188-6-4:2019 - Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Sponsored link
download between 0-24 hoursReleased: 2019-05-02
IEC 61188-6-4:2019 - Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4: Conception de la zone de report - Exigences génériques pour les dessins dimensionnels de composants montés en surface (CMS) du point de vue de la conception de la zone de report

CURRENCY
LANGUAGE
English/French - Bilingual
Standard number:IEC 61188-6-4:2019
Released:2019-05-02
Language:English/French - Bilingual
DESCRIPTION

IEC 61188-6-4:2019

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.