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download between 0-24 hoursReleased: 2023-07-26
IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées
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Standard number: | IEC 61189-2-803:2023 |
Released: | 2023-07-26 |
Language: | English/French - Bilingual |
DESCRIPTION
IEC 61189-2-803:2023
IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).