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Homepage>IEC Standards>IEC 61189-5-503:2017 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
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download between 0-24 hoursReleased: 2017-05-22
IEC 61189-5-503:2017 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

IEC 61189-5-503:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-503: Méthode d’essai générale pour les matériaux et les assemblages – Essais des filaments anodiques conducteurs (CAF) des cartes à circuits

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Standard number:IEC 61189-5-503:2017
Released:2017-05-22
Language:English
DESCRIPTION

IEC 61189-5-503:2017

IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

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