PRICES include / exclude VAT
Homepage>IEC Standards>IEC 61190-1-2:2014 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Sponsored link
download between 0-24 hoursReleased: 2014-02-19
IEC 61190-1-2:2014 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

IEC 61190-1-2:2014

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Matériaux de fixation pour les assemblages électroniques - Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
183.34 USD
English/French - Bilingual Hardcopy
in stock
183.34 USD
Standard number:IEC 61190-1-2:2014
Released:2014-02-19
Language:English/French - Bilingual
DESCRIPTION

IEC 61190-1-2:2014

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of "Reflow condition and profile" in Annex B; c) addition of a new Annex C.