PRICES include / exclude VAT
Homepage>IEC Standards>IEC 61191-2:2017 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Sponsored link
download between 0-24 hoursReleased: 2017-05-23
IEC 61191-2:2017 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

IEC 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface

CURRENCY
LANGUAGE
Standard number:IEC 61191-2:2017
Released:2017-05-23
Language:English
DESCRIPTION

IEC 61191-2:2017

IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added. The contents of the corrigendum of September 2019 have been included in this copy.

This product includes: