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Homepage>IEC Standards>IEC 61191-3:2017 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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download between 0-24 hoursReleased: 2017-05-30
IEC 61191-3:2017 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

IEC 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Ensembles de cartes imprimées - Partie 3: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage de trous traversants

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Standard number:IEC 61191-3:2017
Released:2017-05-30
Language:English
DESCRIPTION

IEC 61191-3:2017

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

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