PRICES include / exclude VAT
download between 0-24 hoursReleased: 2015-03-05
IEC 62047-16:2015
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 16: Méthodes d'essai pour déterminer les contraintes résiduelles des films de MEMS - Méthodes de la courbure de la plaquette et de déviation de poutre en porte-à-faux
Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
48.89 USD
English/French - Bilingual Hardcopy
in stock
48.89 USD
| Standard number: | IEC 62047-16:2015 |
| Released: | 2015-03-05 |
| Language: | English/French - Bilingual |
DESCRIPTION
IEC 62047-16:2015
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.