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Homepage>IEC Standards>IEC 62047-18:2013 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
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download between 0-24 hoursReleased: 2013-07-17
IEC 62047-18:2013 - Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

IEC 62047-18:2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 18: Méthodes d'essai de flexion des matériaux en couche mince

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Standard number:IEC 62047-18:2013
Released:2013-07-17
Language:English/French - Bilingual
DESCRIPTION

IEC 62047-18:2013

IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.

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