New VDA 4: 2020, English version 2021 is avilable here.

 

PRICES include / exclude VAT
Homepage>IEC Standards>IEC 62047-38:2021 - Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
Sponsored link
download between 0-24 hoursReleased: 2021-06-23

IEC 62047-38:2021

Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

Format
Availability
Price and currency
English PDF
Immediate download
90.59 USD
English Hardcopy
in stock
90.59 USD
Standard number:IEC 62047-38:2021
Released:2021-06-23
Language:English
DESCRIPTION

IEC 62047-38:2021

IEC 62047-38:2021(E) specifies a test method for measuring the adhesion strength of metal powder paste in the electrical interconnection between micro-electromechanical systems (MEMS) and a circuit board. The typical examples of metal powder paste are anisotropic conductive paste, solder paste, and nanoscale metallic inks. This testing method is valid for metal powder diameters from 10 µm and 500 µm. In this test method, a uniaxial compression load is applied to metal powder paste using a glass lens simulating an actual MEMS device; then, the adhesion strength is measured by retracting the lens. This test method is proper when the adhesion strength should be analyzed by considering the actual contact area between the MEMS device and metal powder particles.