PRICES include / exclude VAT
download between 0-24 hoursReleased: 2010-04-22
IEC 62418:2010
Semiconductor devices - Metallization stress void test
Dispositifs à semiconducteurs - Essai sur les cavités dues aux contraintes de la métallisation
Format
Availability
Price and currency
English/French - Bilingual PDF
Immediate download
124.20 EUR
English/French - Bilingual Hardcopy
in stock
124.20 EUR
| Standard number: | IEC 62418:2010 |
| Released: | 2010-04-22 |
| Edition: | 1 |
| ICS: | 31.080.01 |
| Pages (English/French - Bilingual): | 34 |
| ISBN (English/French - Bilingual): | 9782889106974 |
DESCRIPTION
IEC 62418:2010
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.