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immediate downloadReleased: 2010-04-22
IEC 62418:2010
Semiconductor devices - Metallization stress void test
Dispositifs à semiconducteurs - Essai sur les cavités dues aux contraintes de la métallisation
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| Standard number: | IEC 62418:2010 |
| Released: | 2010-04-22 |
| Edition: | 1 |
| ICS: | 31.080.01 |
| Pages (English/French - Bilingual): | 34 |
| ISBN (English/French - Bilingual): | 9782889106974 |
DESCRIPTION
IEC 62418:2010
IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.