IEC 62769-1:2023

IEC 62769-1:2023 is available as IEC 62769-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-1:2023 describes the concepts and overview of the Field Device Integration (FDI®[1]) specifications. The detailed motivation for the creation of this technology is also described . Reading this document is helpful to understand the other parts of this multi-part standard. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.