PRICES include / exclude VAT
Homepage>IEC Standards>IEC 62769-6:2023 RLV - Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
download between 0-24 hoursReleased: 2023-04-06
IEC 62769-6:2023 RLV - Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

IEC 62769-6:2023 RLV

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

Format
Availability
Price and currency
English PDF
Immediate download
31.78 USD
English Hardcopy
in stock
31.78 USD
Standard number:IEC 62769-6:2023 RLV
Released:2023-04-06
Language:English
DESCRIPTION

IEC 62769-6:2023 RLV

IEC 62769-6:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.