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Homepage>IEC 62899-202-5:2018 - Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
download between 0-24 hoursReleased: 2018-09-28
IEC 62899-202-5:2018 - Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

IEC 62899-202-5:2018

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

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Standard number:IEC 62899-202-5:2018
Released:2018-09-28
Language:English
DESCRIPTION

IEC 62899-202-5:2018

IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.