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Main page>IEC Standards>IEC 63378-6:2026 - Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
immediate downloadReleased: 2026-02-04
IEC 63378-6:2026 - Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

IEC 63378-6:2026

Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Normalisation thermique des boîtiers de semiconducteurs - Partie 6: Modèle de résistance thermique et de capacité pour la prédiction de la température transitoire aux points de jonction et de mesure

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View table of Contents
Standard number:IEC 63378-6:2026
Released:2026-02-04
Edition:1
ICS:31.080.01
Pages (English):28
ISBN (English):9782832710012
Pages (English/French - Bilingual):57
ISBN (English/French - Bilingual):9782832710012
DESCRIPTION

IEC 63378-6:2026

IEC 63378-6:2026 specifies a thermal resistance and capacitance model for semiconductor packages. This model is named the digital transformation using thermal resistance and capacitance (DXRC) model. It predicts transient temperature at junction and measurement points.
This document applies to semiconductor packages such as TO-252, TO-263, and HSOP. It supports single chip packages dissipated heat from single package surface.

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