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14925 results
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IEC 61029-2-3:1993/AMD1:2001
Amendment 1 - Safety of transportable motor-operated electric tools - Part 2: Particular requirements for planers and thicknessers
Released: 2001-11-27
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12.71 USD
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IEC 61643-321:2001
Components for low-voltage surge protective devices - Part 321: Specifications for avalanche breakdown diode (ABD)
Released: 2001-12-04
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101.65 USD
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IEC 60191-6-2:2001
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Released: 2001-12-11
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IEC 61249-2-10:2003
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Released: 2003-02-27
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203.29 USD
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203.29 USD
IEC 60661:1999+AMD1:2003 CSV
Methods for measuring the performance of electric household coffee makers
Released: 2003-03-04
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108.00 USD
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108.00 USD
IEC 62315-1:2003
DTV profiles for uncompressed digital video interfaces - Part 1: General
Released: 2003-03-27
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374.82 USD
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374.82 USD
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IEC 61959:2004
Secondary cells and batteries containing alkaline or other non-acid electrolytes - Mechanical tests for sealed portable secondary cells and batteries
Released: 2004-01-27
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IEC 60286-6:2004
Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components
Released: 2004-02-05
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101.65 USD
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IEC 61086-3-1:2004
Coatings for loaded printed wire boards (conformal coatings) - Part 3-1: Specifications for individual materials - Coatings for general purpose (Class 1), high reliability (Class 2) and aerospace (Class 3)
Released: 2004-02-09
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50.82 USD
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IEC 60191-2Z:2000
Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
Released: 2000-09-29
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25.41 USD
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IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
Released: 2000-09-29
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146.12 USD
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146.12 USD
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IEC 61466-2:1998/AMD1:2002
Amendment 1 - Composite string insulator units for overhead lines with a nominal voltage greater than 1 000 V - Part 2: Dimensional and electrical characteristics
Released: 2002-01-10
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14925 results
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