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Homepage>IEC Standards>IEC TR 62866:2014 - Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
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download between 0-24 hoursReleased: 2014-05-07
IEC TR 62866:2014 - Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

IEC TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

Migration électrochimique dans les cartes à circuits imprimés et assemblages - Mécanismes et essais

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Standard number:IEC TR 62866:2014
Released:2014-05-07
Language:English/French - Bilingual
DESCRIPTION

IEC TR 62866:2014

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

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