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immediate downloadReleased: 2019-03-20
IEC TR 62878-2-7:2019
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
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| Standard number: | IEC TR 62878-2-7:2019 |
| Released: | 2019-03-20 |
| Edition: | 1 |
| ICS: | 31.180 |
| Pages (English): | 12 |
| ISBN (English): | 9782832266809 |
DESCRIPTION
IEC TR 62878-2-7:2019
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.