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Homepage>IEC Standards>IEC TR 62878-2-7:2019 - Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
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download between 0-24 hoursReleased: 2019-03-20
IEC TR 62878-2-7:2019 - Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

IEC TR 62878-2-7:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

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Standard number:IEC TR 62878-2-7:2019
Released:2019-03-20
Language:English
DESCRIPTION

IEC TR 62878-2-7:2019

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

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