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Homepage>IEC Standards>IEC TS 62647-2:2012 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
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download between 0-24 hoursReleased: 2012-11-29
IEC TS 62647-2:2012 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

IEC TS 62647-2:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin

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Standard number:IEC TS 62647-2:2012
Released:2012-11-29
Language:English
DESCRIPTION

IEC TS 62647-2:2012

IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.

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