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Homepage>IEC Standards>IEC TS 62878-2-3:2015 - Device embedded substrate - Part 2-3: Guidelines - Design guide
download between 0-24 hoursReleased: 2015-03-27
IEC TS 62878-2-3:2015 - Device embedded substrate - Part 2-3: Guidelines - Design guide

IEC TS 62878-2-3:2015

Device embedded substrate - Part 2-3: Guidelines - Design guide

Substrat avec appareil(s) intégré(s) - Partie 2-3: Directives - Guide de conception

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Standard number:IEC TS 62878-2-3:2015
Released:2015-03-27
Language:English/French - Bilingual
DESCRIPTION

IEC TS 62878-2-3:2015

IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.