IPC-2222 - Revision A
Sectional Design Standard for Rigid Organic Printed Boards
| Standard Number: | IPC-2222 - Revision A |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| Released: | 14.12.2010 |
| ISBN (English): | 1-580986-78-1 |
| Pages (English): | 33 |
| ISBN (French): | 978-1-61193-193-8 |
| Pages (French): | 33 |
Superseded by IPC-2222-Revision B
Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision A provides new design guidance and requirements for dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes.33 pages. Released December 2010.