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Current revisionReleased: 01.10.2020
IPC-2222 - Revision B
Sectional Design Standard for Rigid Organic Printed Boards
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Chinese Secure PDF
Immediate download
Non-printable
159.00 USD
Chinese Hardcopy
10-14 days
238.51 USD
English Secure PDF
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Non-printable
159.00 USD
English Hardcopy
10-14 days
238.51 USD
French Secure PDF
Immediate download
Non-printable
269.00 USD
French Hardcopy
10-14 days
403.51 USD
View table of Contents
| Standard Number: | IPC-2222 - Revision B |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| Released: | 01.10.2020 |
| ISBN (English): | 978-1-951577-71-1 |
| Pages (English): | 36 |
| ISBN (Chinese): | 978-1-63816-049-6 |
| Pages (Chinese): | 36 |
| ISBN (French): | 978-1-951577-96-4 |
| Pages (French): | 36 |
DESCRIPTION
IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision B provides new design guidance and requirements for laminate selection, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios, via hole size and printed board edge spacing.
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