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>IPC Standards>Printed board>IPC-2222 - Revision B
 Current revisionReleased: 01.10.2020
IPC-2222  - Revision B

IPC-2222 - Revision B

Sectional Design Standard for Rigid Organic Printed Boards

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View table of Contents
Standard Number:IPC-2222 - Revision B
DOD Adopted:No
ANSI Approved:No
Revision:B
Released:01.10.2020
ISBN (English):978-1-951577-71-1
Pages (English):36
ISBN (Chinese):978-1-63816-049-6
Pages (Chinese):36
ISBN (French):978-1-951577-96-4
Pages (French):36
DESCRIPTION

IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision B provides new design guidance and requirements for laminate selection, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios, via hole size and printed board edge spacing.

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