IPC-7091 - Revision A

This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.