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IPC-7094 - Revision A
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
Released: 01.01.2018
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7095 - Revision C
Design and Assembly Process Implementation for BGAs
Design and Assembly Process Implementation for BGAs
Released: 28.01.2013
Chinese Secure PDF
Immediate download
Non-printable
198.00 USD
Chinese Hardcopy
10-14 days
297.00 USD
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7095 - Revision A
Design and Assembly Process Implementation for BGAs
Design and Assembly Process Implementation for BGAs
Released: 01.10.2004
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7095 - Revision D - With Amendment 1
Design and Assembly Process Implementation for BGAs
Design and Assembly Process Implementation for BGAs
Released: 01.06.2019
Chinese Secure PDF
Immediate download
Non-printable
198.00 USD
Chinese Hardcopy
10-14 days
297.00 USD
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
Japanese Secure PDF
Immediate download
Non-printable
297.00 USD
Japanese Hardcopy
10-14 days
445.51 USD
IPC-J-STD-028 - Standard Only
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Performance Standard for Construction of Flip Chip and Chip Scale Bumps
Released: 01.08.1999
English Secure PDF
Immediate download
Non-printable
155.00 USD
English Hardcopy
10-14 days
232.51 USD
IPC-SM-784 - Standard Only
Guidelines for Chip-on-Board Technology Implementation
Guidelines for Chip-on-Board Technology Implementation
Released: 01.11.1990
English Secure PDF
Immediate download
Non-printable
155.00 USD
English Hardcopy
10-14 days
232.51 USD
IPC-7093 - Standard Only
Design and Assembly Process Implementation for Bottom Termination Components
Design and Assembly Process Implementation for Bottom Termination Components
Released: 28.03.2011
Chinese Secure PDF
Immediate download
Non-printable
198.00 USD
Chinese Hardcopy
10-14 days
297.00 USD
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7094 - Standard Only
Design and Assembly Process Implementation for Flip Chip and Die Size Components
Design and Assembly Process Implementation for Flip Chip and Die Size Components
Released: 18.03.2009
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-J-STD-026 - Standard Only
Semiconductor Design Standard for Flip Chip Applications
Semiconductor Design Standard for Flip Chip Applications
Released: 01.08.1999
English Secure PDF
Immediate download
Non-printable
155.00 USD
English Hardcopy
10-14 days
232.51 USD
IPC-7091 - Standard Only
Design and Assembly Process Implementation of 3D Components
Design and Assembly Process Implementation of 3D Components
Released: 02.06.2017
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7092 - Standard Only
Design and Assembly Process Implementation for Embedded Components
Design and Assembly Process Implementation for Embedded Components
Released: 18.02.2015
Chinese Secure PDF
Immediate download
Non-printable
198.00 USD
Chinese Hardcopy
10-14 days
297.00 USD
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7093 - Revision A
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Released: 01.10.2020
Chinese Secure PDF
Immediate download
Non-printable
198.00 USD
Chinese Hardcopy
10-14 days
297.00 USD
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
Japanese Secure PDF
Immediate download
Non-printable
277.00 USD
Japanese Hardcopy
10-14 days
415.51 USD