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17 results
First pagePrev12IPC-7095 - Revision B
Design and Assembly Process Implementation for BGAs
Design and Assembly Process Implementation for BGAs
Released: 02.04.2008
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7093 - Revision B
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Released: 01.02.2026
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7091 - Revision A
Design and Assembly Process Implementation of 3D Components
Design and Assembly Process Implementation of 3D Components
Released: 01.01.2023
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
IPC-7092 - Revision A
Design and Assembly Process Implementation for Embedded Circuitry
Design and Assembly Process Implementation for Embedded Circuitry
Released: 01.10.2022
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
Japanese Secure PDF
Immediate download
Non-printable
277.00 USD
Japanese Hardcopy
10-14 days
415.51 USD
IPC-7095 - Revision E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
Released: 12.09.2024
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
17 results
First pagePrev12