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Current revisionReleased: 18.03.2009
IPC-9703 - Standard Only
IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
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Chinese Secure PDF
Immediate download
Non-printable
168.30 EUR
Chinese Hardcopy
10-14 days
252.45 EUR
English Secure PDF
Immediate download
Non-printable
94.35 EUR
English Hardcopy
10-14 days
141.53 EUR
View table of Contents
| Standard Number: | IPC-9703 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 18.03.2009 |
| Pages (English): | 42 |
| ISBN (Chinese): | 978-1-61193-404-5 |
| Pages (Chinese): | 48 |
DESCRIPTION
Establishes mechanical drop and shock and test guidelines for assessing solder joint reliability of printed board assemblies from system to component level. This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests. 42 pages. Released March 2009. Included in the C-103 and C-1000 Collections.