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Current revisionReleased: 01.01.2006
IPC-HDBK-005 - Standard Only
Guide to Solder Paste Assessment
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Chinese Secure PDF
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198.00 USD
Chinese Hardcopy
10-14 days
297.00 USD
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
View table of Contents
| Standard Number: | IPC-HDBK-005 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 01.01.2006 |
| Pages (English): | 60 |
| ISBN (Chinese): | 978-1-61193-362-8 |
| Pages (Chinese): | 52 |
DESCRIPTION
This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help with designing and testing solder pastes. It is intended for use by both vendors and users of solder paste. This document has been written as a guide to assess the applicability of a solder paste for a specific process, given the tremendous number of permutations of different materials, atmospheres and process variables currently available.
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