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Released: 14.02.2012
IPC-J-STD-005 - Revision A
Requirements for Soldering Pastes
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Chinese Secure PDF
Immediate download
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94.35 EUR
Chinese Hardcopy
10-14 days
141.53 EUR
English Secure PDF
Immediate download
Non-printable
94.35 EUR
English Hardcopy
10-14 days
141.53 EUR
Japanese Secure PDF
Immediate download
Non-printable
130.05 EUR
Japanese Hardcopy
10-14 days
195.08 EUR
View table of Contents
| Standard Number: | IPC-J-STD-005 - Revision A |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | A |
| Released: | 14.02.2012 |
| ISBN (English): | 978-1-61193-038-2 |
| Pages (English): | 24 |
| ISBN (Chinese): | 978-1-61193-088-7 |
| Pages (Chinese): | 10 |
| ISBN (Japanese): | 978-1-61193-494-6 |
| Pages (Japanese): | 24 |
DESCRIPTION
Superseded by IPC-J-STD-005-Revision-B
This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005.
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Chinese Secure PDF
Immediate download
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168.30 EUR
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10-14 days
252.45 EUR
English Secure PDF
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168.30 EUR
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10-14 days
252.45 EUR