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Current revisionReleased: 01.03.2024
IPC-J-STD-005 - Revision B
Requirements for Solder Pastes
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141.53 EUR
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View table of Contents
| Standard Number: | IPC-J-STD-005 - Revision B |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Revision: | B |
| Released: | 01.03.2024 |
| ISBN (English): | 978-1-63816-170-7 |
| Pages (English): | 24 |
| ISBN (Chinese): | 978-1-63816-220-9 |
| Pages (Chinese): | 22 |
DESCRIPTION
IPC J-STD-005B standard lists the requirements for qualification and characterization of solder paste. It references test methods, criteria, and metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment.
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Chinese Secure PDF
Immediate download
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168.30 EUR
Chinese Hardcopy
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252.45 EUR
English Secure PDF
Immediate download
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168.30 EUR
English Hardcopy
10-14 days
252.45 EUR