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Current revisionReleased: 01.11.1990
IPC-SM-784 - Standard Only
Guidelines for Chip-on-Board Technology Implementation
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English Secure PDF
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Non-printable
131.75 EUR
English Hardcopy
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197.63 EUR
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| Standard Number: | IPC-SM-784 - Standard Only |
| DOD Adopted: | No |
| ANSI Approved: | No |
| Released: | 01.11.1990 |
| Pages (English): | 53 |
DESCRIPTION
Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques. 53 pages. Released November 1990.