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Assembly support
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Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
IPC-9262 - Standard Only
Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment
Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment
Released: 01.12.2016
English Secure PDF
Immediate download
Non-printable
155.00 USD
English Hardcopy
10-14 days
232.51 USD
IPC-9702 - With Amendment 1
Monotonic Bend Characterization of Board-Level Interconnects
Monotonic Bend Characterization of Board-Level Interconnects
Released: 18.08.2015
English Secure PDF
Immediate download
Non-printable
111.00 USD
English Hardcopy
10-14 days
166.51 USD
IPC-7526 - Revision A
Stencil and Misprinted Board Cleaning Handbook
Stencil and Misprinted Board Cleaning Handbook
Released: 01.03.2022
English Secure PDF
Immediate download
Non-printable
186.00 USD
English Hardcopy
10-14 days
279.00 USD
IPC-7530 - Standard Only
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Released: 01.05.2001
Chinese Secure PDF
Immediate download
Non-printable
198.00 USD
Chinese Hardcopy
10-14 days
297.00 USD
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
Hungarian Secure PDF
Immediate download
Non-printable
155.00 USD
Hungarian Hardcopy
10-14 days
232.51 USD
IPC-7530 - Revision B
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
Released: 31.01.2025
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD
Japanese Secure PDF
Immediate download
Non-printable
277.00 USD
Japanese Hardcopy
10-14 days
415.51 USD
IPC-7711-21 - Revision D - Redline
Rework, Modification and Repair of Electronic Assemblies Redline
Rework, Modification and Repair of Electronic Assemblies Redline
Released: 01.01.2024
English Secure PDF
Immediate download
Non-printable
597.00 USD
IPC-9701 - Revision B
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Released: 01.02.2022
English Secure PDF
Immediate download
Non-printable
111.00 USD
English Hardcopy
10-14 days
166.51 USD
IPC-9707 - Standard Only
Spherical Bend Test Method for Characterization of Board Level Interconnects
Spherical Bend Test Method for Characterization of Board Level Interconnects
Released: 13.09.2011
English Secure PDF
Immediate download
Non-printable
198.00 USD
English Hardcopy
10-14 days
297.00 USD