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Homepage>ISO/TS 10303-1650 Industrial automation systems and integration - Product data representation and exchange - Part 1650: Application module: Bare die
download between 0-24 hoursReleased: 2018
ISO/TS 10303-1650 Industrial automation systems and integration - Product data representation and exchange - Part 1650: Application module: Bare die

ISO/TS 10303-1650

Industrial automation systems and integration - Product data representation and exchange - Part 1650: Application module: Bare die

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LANGUAGE
English
Standard´s number:ISO/TS 10303-1650
Pages:11
Edition:5
Released:2018
Language:English
DESCRIPTION

ISO/TS 10303-1650


ISO/TS 10303-1650:2018-11 specifies the application module for Bare die. The following is within the scope of ISO/TS 10303-1650:2018-11: The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package. definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.