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Homepage>BS Standards>31 ELECTRONICS>31.020 Electronic components in general>PD IEC TR 60286-7:2019 Packaging of components for automatic handling Introduction of a bulk blister pack for miniaturized components
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immediate downloadReleased: 2019-10-29
PD IEC TR 60286-7:2019 Packaging of components for automatic handling Introduction of a bulk blister pack for miniaturized components

PD IEC TR 60286-7:2019

Packaging of components for automatic handling Introduction of a bulk blister pack for miniaturized components

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Standard number:PD IEC TR 60286-7:2019
Pages:16
Released:2019-10-29
ISBN:978 0 539 03266 6
Status:Standard
DESCRIPTION

PD IEC TR 60286-7:2019


This standard PD IEC TR 60286-7:2019 Packaging of components for automatic handling is classified in these ICS categories:
  • 31.020 Electronic components in general
  • 31.240 Mechanical structures for electronic equipment

This part of IEC 60286 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.