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immediate downloadReleased: 2022-10-31
PD IEC TR 61760-3-1:2022
Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
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| Standard number: | PD IEC TR 61760-3-1:2022 |
| Pages: | 30 |
| Released: | 2022-10-31 |
| ISBN: | 978 0 539 17936 1 |
| Status: | Standard |
DESCRIPTION
PD IEC TR 61760-3-1:2022
This standard PD IEC TR 61760-3-1:2022 Surface mounting technology is classified in these ICS categories:
- 31.190 Electronic component assemblies