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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>PD IEC TR 62878-2-7:2019 Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
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immediate downloadReleased: 2019-04-01
PD IEC TR 62878-2-7:2019 Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards

PD IEC TR 62878-2-7:2019

Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards

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Standard number:PD IEC TR 62878-2-7:2019
Pages:16
Released:2019-04-01
ISBN:978 0 539 03359 5
Status:Standard
DESCRIPTION

PD IEC TR 62878-2-7:2019


This standard PD IEC TR 62878-2-7:2019 Device embedding assembly technology is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies

This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.


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