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Homepage>BS Standards>03 SOCIOLOGY. SERVICES. COMPANY ORGANIZATION AND MANAGEMENT. ADMINISTRATION. TRANSPORT>03.100 Company organization and management>03.100.50 Production. Production management>PD IEC/TS 62647-4:2018 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Ball grid array (BGA) re-balling
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immediate downloadReleased: 2018-04-25
PD IEC/TS 62647-4:2018 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Ball grid array (BGA) re-balling

PD IEC/TS 62647-4:2018

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Ball grid array (BGA) re-balling

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Standard number:PD IEC/TS 62647-4:2018
Pages:44
Released:2018-04-25
ISBN:978 0 580 97334 5
Status:Standard
DESCRIPTION

PD IEC/TS 62647-4:2018


This standard PD IEC/TS 62647-4:2018 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder is classified in these ICS categories:
  • 49.060 Aerospace electric equipment and systems
  • 31.020 Electronic components in general
  • 03.100.50 Production. Production management
IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.