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IPC-9121 - Amendment 1
Troubleshooting for PCB Fabrication Processes
Troubleshooting for PCB Fabrication Processes
Released: 02.04.2018
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IPC-9194 - Standard Only
Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
Released: 01.09.2004
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IPC-9241 - Standard Only
Guidelines for Microsection Preparation
Guidelines for Microsection Preparation
Released: 01.12.2016
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198.00 USD
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IPC-9301 - Standard Only
Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
Released: 01.12.2018
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IPC-9592 - Revision B
Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
Released: 14.01.2013
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IPC-9701 - Revision B
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Released: 01.02.2022
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IPC-9707 - Standard Only
Spherical Bend Test Method for Characterization of Board Level Interconnects
Spherical Bend Test Method for Characterization of Board Level Interconnects
Released: 13.09.2011
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IPC-A-600
Acceptability of Printed Boards
Acceptability of Printed Boards
Released: 30.07.2004
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IPC-A-610 - Revision E
Acceptability of Electronic Assemblies
Acceptability of Electronic Assemblies
Released: 13.04.2010
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IPC-A-610 - Revision G - Telecom Addendum
Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
Released: 01.10.2019
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IPC-A-610 - Revision H
Acceptability of Electronic Assemblies
Acceptability of Electronic Assemblies
Released: 01.09.2020
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IPC-CH-65 - Revision B
Guidelines for Cleaning of Printed Boards and Assemblies
Guidelines for Cleaning of Printed Boards and Assemblies
Released: 25.07.2011
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