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UNE EN 62047-9:2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
Released: 2012-06-01
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UNE EN 62087-4:2016
Audio, video and related equipment - Determination of power consumption - Part 4: Video recording equipment (Endorsed by AENOR in April of 2016.)
Audio, video and related equipment - Determination of power consumption - Part 4: Video recording equipment (Endorsed by AENOR in April of 2016.)
Released: 2016-04-01
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UNE EN 62087-6:2015
Audio, video and related equipment - Determination of power consumption - Part 6: Audio equipment (Endorsed by AENOR in October of 2015.)
Audio, video and related equipment - Determination of power consumption - Part 6: Audio equipment (Endorsed by AENOR in October of 2015.)
Released: 2015-10-01
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UNE EN 62121:2001
Methods of measurement for minidisc recorders/players (Endorsed by AENOR in May of 2002.)
Methods of measurement for minidisc recorders/players (Endorsed by AENOR in May of 2002.)
Released: 2002-05-01
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UNE EN 62135-1:2015
Resistance welding equipment - Part 1: Safety requirements for design, manufacture and installation (Endorsed by AENOR in August of 2015.)
Resistance welding equipment - Part 1: Safety requirements for design, manufacture and installation (Endorsed by AENOR in August of 2015.)
Released: 2015-08-01
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UNE EN 62135-1:2015/AC:2016-02
Resistance welding equipment - Part 1: Safety requirements for design, manufacture and installation (Endorsed by AENOR in April of 2016.)
Resistance welding equipment - Part 1: Safety requirements for design, manufacture and installation (Endorsed by AENOR in April of 2016.)
Released: 2016-04-01
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UNE EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (Endorsed by AENOR in April of 2012.)
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (Endorsed by AENOR in April of 2012.)
Released: 2012-04-01
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