This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. IEC 60068-2-54 has now been integrated into this latest Standard Revision. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are applicable to components and boards with metallic terminations and metallized solder pads. This standard provides the measurement procedures for solder alloys both with and without lead (Pb). The user should note that this test is intended to provide consistent and discriminatory data between various test sites, hence the choice of alloy, temperature and flux must be controlled. Using this test method to control a production process is encouraged however, as each production process will employ different alloy s, temperatures and fluxes, such test results need to be agreed between the user and the supplier. In the event of a dispute, this Standards procedures shall prevail.